Software Engineering Manager

Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power wireless connectivity, building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the world’s most highly integrated SoCs, Silicon Labs provides device makers the solutions, support, and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin, Texas, Silicon Labs has operations in over 16 countries and is the trusted partner for innovative solutions in the smart home, industrial IoT, and smart cities markets. Learn more at www.silabs.com.

Bluetooth® Low Energy (Bluetooth LE) is a cornerstone of Silicon Labs' wireless portfolio and a key technology enabling secure, intelligent, and energy-efficient IoT devices across smart homes, commercial buildings, healthcare, industrial automation, asset tracking, and emerging connected applications. As a foundational technology within our multiprotocol wireless platform, Bluetooth LE plays a critical role in delivering scalable, interoperable, and secure connectivity for millions of IoT devices worldwide.

We are looking for an experienced Software Engineering Manager to lead our Bluetooth LE Link Layer Software team in Espoo, Finland. The Link Layer is at the core of Bluetooth LE software, delivering the real-time protocol execution, scheduling, performance, and interoperability that differentiate Silicon Labs' Bluetooth software platform.

Our Bluetooth LE Software organization is built around deep technical ownership. We own the long-term architecture, quality, and evolution of the Bluetooth Controller and Host software while working as part of cross-functional execution teams delivering strategic initiatives such as next-generation Bluetooth features, performance optimization, interoperability, and security.

In this role, you will lead a team of highly skilled embedded software engineers while partnering closely with the Link Layer Architect to define the technical direction and execute the Bluetooth LE Link Layer Software roadmap. You will collaborate with globally distributed teams across IC Design, SDK, Quality Assurance, Validation, Product Management, Applications Engineering, and Customer Support to deliver high-quality Bluetooth software that powers the next generation of IoT devices.

We are looking for a leader who combines outstanding people leadership with deep embedded software expertise and embraces modern engineering practices, including AI-assisted software engineering, to continuously improve engineering productivity, software quality, and execution.

Our Engineering Culture

We believe exceptional engineering organizations combine deep technical ownership with cross-functional execution. Our engineering managers build enduring technical capabilities while partnering across software, silicon, validation, product management, and customer-facing teams to deliver meaningful customer outcomes.

We foster a culture of technical curiosity, engineering excellence, continuous learning, and data-driven decision making. We embrace AI-assisted software engineering to accelerate innovation, improve software quality, enhance developer productivity, and continuously improve engineering effectiveness through modern engineering practices and metrics.

Our leaders empower engineers and architects to make sound technical decisions, develop future technical leaders, and build high-performing, collaborative teams. Success is measured not only by delivering great software, but also by creating an engineering organization that continuously improves in quality, predictability, and execution through modern engineering practices, including DORA metrics and continuous improvement.

Engineering Leadership

Technical Leadership

Cross-Functional Execution

Engineering Excellence

• 3+ years of experience leading and managing software engineering teams delivering complex embedded software products.
• Strong people leadership with demonstrated success hiring, mentoring, coaching, and developing engineering talent.
• Several years of hands-on embedded software development experience using C.
• Strong background in highly resource-constrained, real-time embedded systems.
• Experience developing embedded communication protocols or wireless software, preferably Bluetooth Low Energy or similar wireless technologies.
• Strong understanding of software architecture, software development lifecycle, Agile methodologies, and modern engineering practices.
• Experience with continuous integration, automated testing, DevOps, and engineering automation.
• Experience using engineering collaboration and project management tools such as Jira, Confluence, Git, and CI/CD platforms.
• Demonstrated success working across globally distributed, cross-functional engineering organizations.
• Excellent communication, collaboration, stakeholder management, and decision-making skills.
• Demonstrated understanding of modern AI-assisted software engineering practices and the ability to lead teams in adopting AI tools responsibly to improve engineering productivity, software quality, and developer experience.
• Experience with artificial intelligence (AI) powered tools and technologies used to enhance productivity, analysis, and decision-making.
• Experience developing Bluetooth LE Controller (Link Layer) software.
• Experience with the Bluetooth Core Specification, interoperability, and wireless protocol implementation.
• Experience working in the semiconductor or wireless connectivity industry.
• Understanding of radio firmware, scheduling, timing-critical software, or PHY/MAC layer implementations.
• Experience working closely with silicon design, firmware, and hardware verification teams.
• Knowledge of additional IoT communication technologies such as Matter, Thread, Zigbee, Wi-Fi, Wi-SUN, or Z-Wave.
• Experience with RTOS environments including Zephyr or FreeRTOS.
• Familiarity with embedded debugging tools such as oscilloscopes, logic analyzers, and protocol analyzers.
• Experience contributing to software architecture, technical strategy, and long-term technology roadmaps.
• Experience driving engineering process improvements using engineering metrics and continuous improvement practices.

This is an opportunity to lead one of the industry's most advanced Bluetooth embedded software teams and shape the future of wireless IoT connectivity. You will influence the evolution of Bluetooth LE Link Layer Software, develop exceptional engineering talent, and collaborate with world-class experts across software, silicon, wireless systems, and product engineering.

As a key member of the Bluetooth software leadership team, you will help define the engineering culture, technical direction, and execution model that powers secure, intelligent, and energy-efficient IoT devices for customers around the world.

The annualized base pay range for this role is expected to be between €54,600 - €101,400 EUR. Actual base pay could vary based on factors including but not limited to experience, geographic location where work will be performed and applicant’s skill set. The base pay is just one component of the total compensation package for employees. Other rewards may include an annual cash bonus, equity package and a comprehensive benefits package.

Silicon Labs is an equal opportunity employer and values the diversity of our employees. Employment decisions are made on the basis of qualifications and job-related criteria without regard to race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status, or any other characteristic protected by applicable law.