At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
As Firmware Lead, you will lead implementation and delivery of real-time embedded firmware for Kandou's Randa 1.6T Active Electrical Cable platform. This is a coding-heavy technical leadership role: you will spend the majority of your time writing and reviewing C/C++, debugging firmware and hardware interactions, and supporting pre-silicon and post-silicon bring-up. You will turn the Firmware Architect's system design into production code, own implementation quality and delivery, and mentor engineers while remaining active in the codebase.
Open locations: India (Hyderabad or Bangalore), UK (Reading or Cambridge), Switzerland (Lausanne).